2011. 7. 6 1/6 semiconductor technical data kia2431p/s/t/m/ap/as/ at/am/bm bipolar linear integrated circuit revision no : 6 programmable precision references the kia2431p/s/t/m/ap/as/at/am/bm are integrated circuits are three-terminal programmable shunt regulator diodes. these monolithic ic voltage reference operate as a low temperature coefficient zener which is programmable from v ref to 16 volts with two external resistors. these devices exhibit a wide operating current range of 80 a to 50ma with a typical dynamic impedance of 0.22 ? . the characteristics of these references make them excellent replacements for zener diodes in many applications such as digital voltmeters, power supplies, and op amp circuitry. features h programmable output voltage to 16 volts. line up item package vref tolerance (%) kia2431 p to-92 ? 1.5 s tsm t tsv m sot-23 kia2431 ap to-92 ? 1.0 as tsm at tsv am sot-23 kia2431 bm sot-23 ? 0.5 h low dynamic output impedance : 0.22 ? (typ.). h sink current capability of 80 a to 50ma. h equivalent full-range temperature coefficient of 30ppm/ ? (typ.). h temperature compensated for operation over full rated operating temperature range. h low output noise voltage. type no. marking kia2431t/s/m 24a kia2431at/as/am 24b kia2431bm 24c marking
2011. 7. 6 2/6 kia2431p/s/t/m/ap/as/at/am/bm revision no : 6 electrical characteristics (ta=25 ? ) maximum ratings (ta=25 ? ) (full operating ambient temperature range applies unless otherwise noted.) characteristic symbol rating unit cathode to anode voltage v ka 16 v cathode current range, continuous i k 50 ma reference input current range, continuos i ref 3 ma operating junction temperature t j 150 ? operating temperature t opr -40 q 85 ? storage temperature t stg -65 q 150 ? total power dissipation kia2431p/ap p d 700 mw kia2431s/as (note1) 900 kia2431t/at 550 KIA2431AM/bm (note2) 350 characteristics symbol test circuit test condition min. typ. max. unit reference input voltage kia2431p/s/t/m v ref figure 1 v ka =v ref , i k =10ma 1.222 1.240 1.258 v kia2431ap/as/at/am 1.228 1.240 1.252 v kia2431bm 1.234 1.240 1.246 v reference input voltage deviation over temperature range v ref figure 1 (note 1) v ka =v ref , i k =10ma - 7.0 20 mv ratio of change in reference input voltage to change in cathode to anode voltage v ref / v ka figure 2 i k =10ma v ka = 16v q v ref - -0.6 -1.5 mv/v reference input current ta=25 ? i ref figure 2 i k =10ma, r1=10k ? , r2= ? - 0.15 0.5 a reference input current deviation over temperature range i ref figure 2 i k =10ma, r1=10k ? , r2= ? - 0.05 0.3 a minimum cathode current for regulation i min figure 1 v ka =v ref - 55 80 a off-state cathode current i off figure 3 v ka =16v, v ref =0v - 2.6 1000 na dynamic impedance z ka figure 1 (note 2) v ka =v ref , i k =0.08ma q 50ma, f " 1.0khz - 0.22 0.4 ? note1) package mounted on 99.5% alumina (10 x ? 8 x ? 0.6 x ) note2) package mounted on a ceramic board (600 [ ? 0.8 x )
2011. 7. 6 3/6 kia2431p/s/t/m/ap/as/at/am/bm revision no : 6 example : v ref = 5.0mv and slope is positive, v ref at 25 ? =1.245v, ta=110 ? 0.005 ? 10 6 ? v ref = = 36.5 ppm/ ? 110 ? 1.245 note 2: the dynamic impedance z ka is defined as: vka |z ka | = ik when the device is programmed with two external resistors, r1 and r2, (refer to figure 2) the total dynamic impedance of the circuit is defined as: r1 |z ka' | = |z ka | (1+ ) r2 note 1: the deviation parameter v ref is defined as the differences between the maximum and minimum values obtained over the full operating ambient temperature range that applies. * c ka greater than 100nf is needed for stability. the average temperature coefficient of the reference input voltage, v ref , is defined as: v ref ( ) ? 10 6 ppm v ref at 25 ? ? v ref ( ) = ? ta v ref ? 10 6 = ta(v ref at 25 ? ) ? v ref can be positive or negative depending on whether v ref min. or v ref max. occurs at the lower ambient temperature.
2011. 7. 6 4/6 kia2431p/s/t/m/ap/as/at/am/bm revision no : 6
2011. 7. 6 5/6 kia2431p/s/t/m/ap/as/at/am/bm revision no : 6
precaution for use soldering flat package (tsm/tsv/sot-23 package) elements mounting styles of electronic devices are gaining in further diversification over recent years, and needs for components are all the more expanding in varieties. especially, surface mounting is steadily penetrating into industrial segments as a world-wide popular technical trend. although exposure to high temperature is inevitable during soldering we recommend limiting the soldering temperature to low levels as shown in figure for the sake of retaining inherent excellent reliability. (a) when employing solder reflow method y atmospheric temperature around resin surfaces must be less than 240 ? , not exceeding the time length of 10 sec. t recommend temperature profile ? precautions on heating method when resin in kept exposed to high temperature for a long time, device reliability may be marred. therefore, it is essential to complete soldering in the shortest time possible to prevent temperature of resin from rising. (b) when employing halogen lamps or infrared-ray heaters when halogen lamps or infrared-ray heaters are used, avoid direct irradiation onto resin surfaces; such devices cause extensive localized temperature rise. ? please keep a reflow solder operating when tsm/tsv package's soldering. 2011. 7. 6 6/6 kia2431p/s/t/m/ap/as/at/am/bm revision no : 6
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